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- silicon wafer, <100>, p-type, contains boron as dopant, diam. × thickness 4 in x 525 μm

silicon wafer, <100>, p-type, contains boron as dopant, diam. × thickness 4 in x 525 μm
CAS :
7440-21-3
Grade :
PRIME
Mol. Formula :
Si
HSN Code :
9002
Purity :
Double side polished
Mol. Weight :
28.09
Packing :