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- silicon wafer, <100>, p-type, contains boron as dopant, diam. × thickness 4 inch × 0.525mm
silicon wafer, <100>, p-type, contains boron as dopant, diam. × thickness 4 inch × 0.525mm
CAS :
7440-21-3
Mol. Formula :
Si
HSN Code :
9001 / 9002
Mol. Weight :
28.09
Packing :
