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- silicon wafer (double side polished), <100>, intrinsic, dia x thickness 100 mm x 500 µm
silicon wafer (double side polished), <100>, intrinsic, dia x thickness 100 mm x 500 µm
CAS :
7440-21-3
Mol. Formula :
Si
HSN Code :
9002
Mol. Weight :
28.09
Packing :
